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ic foundry burn, burner, burning base unit supplies one-stop service

139-2550-6787 (WeChat same number)
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Your location  home -> product  ->  Chip burning  ->  WLCSP packaged chip burning

【Origin Pic】

WLCSP packaged chip burning

*Brand: Hailo *Model: 001
*Place of Origin: China *Specifications: By Chip
*Application Range: Program Burning, Chip *Material: Silicon, Glass
*Color: Black *Thickness: 0.5-2mm
*Custom Processing: Yes *Weight: 1g

  Supports various material handling methods, including tube packaging, reel packaging, and tape packaging for chip programming. Compatible with common IC packages on the market, and can develop algorithms for programming operations.

  I. Fast Mass Production and Quick Delivery

  On-site fully automated programming equipment and universal programmers to meet customers' needs for fast mass production and delivery, while ensuring product quality

  Strictly follow IATF16949 production process management to ensure quality control actions are implemented

  Full factory electrostatic protection measures implemented, in compliance with international ESD standards

  Close cooperation with several courier companies to ensure timely delivery of goods

  II. Intelligent Operation Management System

  Hailo's intelligent workflow management system effectively ensures the safe warehousing and out-warehousing of various devices

  Software updates and hardware maintenance

  Professional electronic engineers provide maintenance for programmers and develop dedicated fixtures

  Real-time software updates and special function software development services

  III. Information Security Protection

  Strict implementation of programming file management, and signing of "Confidentiality Agreements" with customers to ensure intellectual property protection

  Insurance for delivery and financial protection to ensure cargo safety

  1. IC Types: MCU/MPU, EPROM, EEPROM, FLASH, Nand Flash, PLD/CPLD, SD Card, TF Card, CF Card, eMMC Card, eMMC, MoviNand, OneNand...

  2. IC Packages: DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN...

  3. IC Packaging: Conversion between Tray, Tube, and Tape

  4. IC Manufacturers: SanDisk, Toshiba, Micron, Samsung, AMD, SST, INTEL, AMIC, WINBOND, ATMEL, HOLTEK, FUJITSU...

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contact us Dongguan Hailo electronic Technology Co., Ltd.

location Building A, No. 44, Hedong 2nd Road, Chang'an Town, Dongguan City

Phone 0769-81589896

mail sales01@gd-hailo.com

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